Intel has announced one of the industry’s first glass substrates for next-generation advanced packaging, planned for the latter part of this decade. This breakthrough achievement will enable the continued scaling of transistors in a package and deliver data-centric applications.

“After a decade of research, Intel has achieved industry-leading glass substrates for advanced packaging. We look forward to delivering these cutting-edge technologies that will benefit our key players and foundry customers for decades to come,” said Babak Sabi, Intel senior vice president and general manager of Assembly and Test Development.

Compared to today’s organic substrates, glass offers distinctive properties such as ultra-low flatness and better thermal and mechanical stability, resulting in much higher interconnect density in a substrate. These benefits will allow chip architects to create high-density, high-performance chip packages for data-intensive workloads such as artificial intelligence. Intel is on track to deliver complete glass substrate solutions to the market in the second half of this decade, allowing the industry to continue advancing Moore’s Law beyond 2030.

Glass substrates can tolerate higher temperatures, offer 50% less pattern distortion, and have ultra-low flatness for improved depth of focus for lithography, and have the dimensional stability needed for extremely tight layer-to-layer interconnect overlay. As a result of these distinctive properties, a 10x increase in interconnect density is possible on glass substrates. Improved mechanical properties of glass enable ultra-large form-factor packages with very high assembly yields. The many benefits of glass bring the industry closer to being able to scale 1 trillion transistors on a package by 2030.

www.intel.com